The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2008
Filed:
Feb. 09, 2005
Kuo Yang Sun, Kaohsiung, TW;
Chia Ming Yang, Tainan, TW;
Hung Yuan LU, Kaohsiung, TW;
Wei Chin Tsai, Kaohsiung, TW;
Yi Cheng Lin, Kaohsiung County, TW;
Kuo Yang Sun, Kaohsiung, TW;
Chia Ming Yang, Tainan, TW;
Hung Yuan Lu, Kaohsiung, TW;
Wei Chin Tsai, Kaohsiung, TW;
Yi Cheng Lin, Kaohsiung County, TW;
Orient Semiconductor Electronics, Limited, Kaohsiung, TW;
Abstract
A semiconductor package includes a substrate, a first chip, a nonconductive adhesive, a second chip and a plurality of supporting balls. The first chip has an upper surface and a lower surface opposite to the upper surface, and the lower surface is mounted on the substrate. The nonconductive adhesive is disposed on the upper surface of the first chip. The second chip has an upper surface and a lower surface opposite to the upper surface, wherein the lower surface is mounted on the upper surface of the first chip by means of the nonconductive adhesive, and the adherent area between the nonconductive adhesive and the second chip is larger than 90% of the area of the lower surface of the second chip. The supporting balls are disposed in the nonconductive adhesive for supporting the second chip.