This inventor holds 1 USPTO granted patent. Top assignee: Orient Semiconductor Electronics, Limited. Active years: 2008.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2008
Title: Yi Cheng Lin: Innovator in Semiconductor Packaging
Introduction
Yi Cheng Lin is a notable inventor based in Kaohsiung County, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and solutions. His work is particularly recognized for its impact on the efficiency and reliability of semiconductor devices.
Latest Patents
Yi Cheng Lin holds a patent for a semiconductor package that includes a substrate, a first chip, a nonconductive adhesive, a second chip, and a plurality of supporting balls. The design features a first chip with an upper surface and a lower surface, where the lower surface is mounted on the substrate. The nonconductive adhesive is applied to the upper surface of the first chip, allowing the second chip to be mounted securely. Notably, the adherent area between the nonconductive adhesive and the second chip exceeds 90% of the area of the lower surface of the second chip. The supporting balls are integrated within the nonconductive adhesive to provide additional support for the second chip. This innovative approach enhances the performance and durability of semiconductor packages.
Career Highlights
Yi Cheng Lin is currently employed at Orient Semiconductor Electronics, Limited, where he continues to develop cutting-edge technologies in semiconductor packaging. His work has positioned him as a key player in the industry, contributing to advancements that benefit various electronic applications.
Collaborations
Some of his coworkers include Kuo Yang Sun and Chia Ming Yang, who collaborate with him on various projects within the company. Their combined expertise fosters an environment of innovation and creativity.
Conclusion
Yi Cheng Lin's contributions to semiconductor packaging exemplify the importance of innovation in technology. His patent reflects a commitment to enhancing the functionality and reliability of electronic devices. Through his work at Orient Semiconductor Electronics, Limited, he continues to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile