The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2005
Filed:
Oct. 10, 2003
Chia-ming Yang, Tainan, TW;
Shu-fen Liang, Kaohsiung, TW;
Shu-min Chou, Tainan Hsien, TW;
Orient Semiconductor Electronics, Ltd., Kaohsiung, TW;
Abstract
In a semiconductor device, a semiconductor chip is mounted on an inner seat body of a heat-dissipating frame mounted on a top surface of a dielectric substrate. Each of multiple bonding wires interconnects electrically one of multiple contact pads on the semiconductor chip and a corresponding one of multiple first conductive contacts on the top surface of the substrate so as to establish electrical connection between the contact pads on the semiconductor chip and multiple second conductive contacts on a bottom surface of the substrate via the first conductive contacts and circuit traces of the substrate. An encapsulant encapsulates the bonding wires, the semiconductor chip, and the inner seat body, a portion of an outer frame body of the heat-dissipating frame, and multiple that interconnect portions interconnecting heat-conductively the inner seat body and the outer frame body.