Kaohsiung, Taiwan

Chia-Ming Yang

USPTO Granted Patents = 13 

Average Co-Inventor Count = 4.5

ph-index = 3

Forward Citations = 34(Granted Patents)


Location History:

  • Taipei, TW (2003)
  • Tainan, TW (2005 - 2022)
  • Kaohsiung, TW (2013 - 2022)

Company Filing History:


Years Active: 2003-2022

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13 patents (USPTO):Explore Patents

Title: Chia-Ming Yang: Innovator in Electronic Packaging

Introduction

Chia-Ming Yang is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 13 patents. His innovative designs and methods have advanced the technology used in semiconductor and electronic components.

Latest Patents

One of his latest patents is an electronic package that includes an electromagnetic shielding structure and a method of manufacture. This electronic package consists of a substrate, an electronic component, a plurality of conductive elements, a metal sheet, and a molding layer. The electronic component is placed on the substrate and is electrically connected to it. The conductive elements are also on the substrate, connecting with the grounding circuit. The metal sheet is positioned above the electronic component, making electrical contact with the conductive elements. The molding layer encloses the electronic component and conductive elements, providing protection and stability.

Another notable patent is a semiconductor package that comprises a heat spreader and a manufacturing method. This semiconductor package includes a redistribution layer, a die, a heat spreader, a thermal interface material, and a molding layer. The die is placed on the redistribution layer, while the heat spreader is positioned on the die. The thermal interface material is applied between the heat spreader and the die, ensuring efficient heat dissipation. The molding layer encloses the die, providing structural integrity to the package.

Career Highlights

Chia-Ming Yang has worked with notable companies such as Orient Semiconductor Electronics Limited and National Cheng Kung University. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in electronic packaging technology.

Collaborations

Throughout his career, Chia-Ming Yang has collaborated with esteemed colleagues, including Yueh-Ming Tung and Jung-Wei Chen. These partnerships have fostered innovation and have led to the development of several impactful patents.

Conclusion

Chia-Ming Yang is a distinguished inventor whose work in electronic packaging has significantly influenced the industry. His patents reflect his commitment to innovation and excellence in technology.

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