The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2022
Filed:
Feb. 02, 2021
Orient Semiconductor Electronics, Limited, Kaohsiung, TW;
Yueh-Ming Tung, Kaohsiung, TW;
Chia-Ming Yang, Kaohsiung, TW;
Jung-Wei Chen, Kaohsiung, TW;
Jian-De Leu, Kaohsiung, TW;
Guan-Lin Pan, Kaohsiung, TW;
ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED, Kaohsiung, TW;
Abstract
The method of manufacturing a semiconductor package of the present disclosure includes: providing a redistribution layer having opposing first surface and second surface; disposing a die on the first surface of the redistribution layer and electrically connecting the die to the redistribution layer; forming a mask on the second surface of the redistribution layer; performing a chemical or plasma etching process on the second surface of the redistribution layer to expose the conductive traces in the redistribution layer; removing the mask; and forming a plurality of conductive bumps on the second surface of the redistribution layer and electrically connecting the conductive bumps to the exposed conductive traces in the redistribution layer.