This inventor holds 2 USPTO granted patents and 6 published patent applications. Top assignee: Orient Semiconductor Electronics, Limited. Active years: 2022.
Company Filing History:
Years Active: 2022
Title: Guan-Lin Pan: Innovator in Semiconductor Technology
Introduction
Guan-Lin Pan is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative semiconductor packaging solutions that enhance performance and efficiency.
Latest Patents
Guan-Lin Pan's latest patents include a semiconductor package comprising a heat spreader and a manufacturing method thereof. This semiconductor package features a redistribution layer, a die, a heat spreader, a thermal interface material, and a molding layer. The die is positioned on the redistribution layer, while the heat spreader is placed on top of the die. The thermal interface material is applied between the heat spreader and the die, and the molding layer encloses the die on the redistribution layer. Additionally, he has developed a manufacturing method for this semiconductor package, which involves several steps including the disposal of a die, forming a mask, and creating conductive bumps.
Career Highlights
Guan-Lin Pan is currently employed at Orient Semiconductor Electronics, Limited, where he continues to innovate in semiconductor technology. His expertise in the field has led to advancements that are crucial for modern electronic devices.
Collaborations
Guan-Lin has collaborated with notable coworkers such as Chia-Ming Yang and Yueh-Ming Tung, contributing to a dynamic work environment that fosters innovation.
Conclusion
Guan-Lin Pan is a key figure in the semiconductor industry, with a focus on developing advanced packaging solutions. His contributions are vital for the ongoing evolution of electronic technology.