Company Filing History:
Years Active: 2022
Title: Jung-Wei Chen: Innovator in Electronic Packaging
Introduction
Jung-Wei Chen is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 3 patents. His work focuses on innovative designs that enhance the functionality and efficiency of electronic components.
Latest Patents
One of his latest patents is titled "Electronic package including electromagnetic shielding structure and method of manufacture." This patent describes an electronic package that consists of a substrate, an electronic component, a plurality of conductive elements, a metal sheet, and a molding layer. The electronic component is mounted on the substrate and is electrically connected to it. The conductive elements are also placed on the substrate, connecting with the grounding circuit. The metal sheet is positioned above the electronic component, ensuring electrical contact with the conductive elements. The molding layer encases the electronic component and conductive elements, providing protection and stability. Additionally, the patent outlines a method for manufacturing this electronic package.
Another notable patent is "Semiconductor package comprising heat spreader and manufacturing method thereof." This invention includes a redistribution layer, a die, a heat spreader, a thermal interface material, and a molding layer. The die is placed on the redistribution layer, while the heat spreader is positioned on top of the die. A thermal interface material is applied between the heat spreader and the die, enhancing thermal management. The molding layer surrounds the die, ensuring its protection. This patent also details the manufacturing process for the semiconductor package.
Career Highlights
Jung-Wei Chen is currently employed at Orient Semiconductor Electronics, Limited, where he continues to innovate in the field of semiconductor technology. His expertise in electronic packaging has positioned him as a key player in the industry.
Collaborations
Throughout his career, Jung-Wei has collaborated with notable colleagues, including Yueh-Ming Tung and Chia-Ming Yang. These partnerships have contributed to the advancement of their shared projects and innovations.
Conclusion
Jung-Wei Chen is a distinguished inventor whose work in electronic packaging has led to several important patents. His contributions continue to shape the future of semiconductor technology, making him a valuable asset in the field.