The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2022
Filed:
Mar. 23, 2021
Orient Semiconductor Electronics, Limited, Kaohsiung, TW;
Yueh-Ming Tung, Kaohsiung, TW;
Chia-Ming Yang, Kaohsiung, TW;
Jung-Wei Chen, Kaohsiung, TW;
Ying-Chuan Li, Kaohsiung, TW;
Ping-Hua Chu, Kaohsiung, TW;
ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED, Kaohsiung, TW;
Abstract
The present disclosure provides an electronic package. The electronic package includes a substrate, an electronic component, a plurality of conductive elements, a metal sheet and a molding layer. The electronic component is disposed on the substrate and electrically connected to the substrate. The conductive elements are disposed on the substrate and electrically connected with the grounding circuit on the substrate. The metal sheet is disposed above the electronic component and is in electrical contact with the conductive elements. The molding layer is formed between the substrate and the metal sheet to enclose the electronic component and the conductive elements. The present disclosure further provides a method of manufacturing the above electronic package.