The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2006
Filed:
Oct. 06, 2004
Applicants:
Kuo-yang Sun, Kao-Hsiung, TW;
Chia-ming Yang, Tai-Nan, TW;
Inventors:
Kuo-Yang Sun, Kao-Hsiung, TW;
Chia-Ming Yang, Tai-Nan, TW;
Assignee:
Orient Semiconductor Electronics, Ltd., Kao-Hsiung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract
A package structure includes a lead frame having a plurality of leads, each of which includes a first recession, at least a first device, and a plurality of solder joints respectively positioned in the first recessions for connecting the first device to the lead frame.