The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2020

Filed:

Nov. 26, 2018
Applicant:

National Cheng Kung University, Tainan, TW;

Inventors:

Po-Tsung Hsieh, Tainan, TW;

Chia-Ming Yang, Tainan, TW;

In-Gann Chen, Tainan, TW;

Shih-Wen Tseng, Tainan, TW;

Ya-Wen Tsai, Tainan, TW;

Ya-Wen Chuang, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 21/50 (2006.01); H01L 23/00 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/50 (2013.01); H01L 21/6715 (2013.01); H01L 21/67121 (2013.01); H01L 21/67126 (2013.01); H01L 21/681 (2013.01); H01L 22/24 (2013.01); H01L 24/95 (2013.01);
Abstract

A chip packaging device is provided, which includes a main body unit, packaging unit and an aligning unit. The main body unit includes a mounting base, holder and a rotational platform. The packaging unit includes upper and lower bonding elements, upper and lower chips and a mask; a vertical axis is at the middle of the upper and the lower bonding elements, and a horizontal axis is above the lower bonding element. The aligning unit includes an aligning detector and a first focusing detector. When the lower chip and the mask are disposed on the lower bonding element, place the liquid sample in the mask and spread a packaging adhesive over the surface thereof; then, remove the mask and use the aligning detector and the first focusing detector to detect the position of the lower chip respectively, such that the chips can be aligned and bonded with each other.


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