Shih-Wen Tseng

Title: Innovations of Shih-Wen Tseng in Chip Packaging Technology

Introduction

Shih-Wen Tseng is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of chip packaging technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and precision of chip packaging processes.

Latest Patents

One of his latest patents is a "Chip packaging device and alignment bonding method thereof." This invention includes a main body unit, packaging unit, and an aligning unit. The main body unit consists of a mounting base, holder, and a rotational platform. The packaging unit features upper and lower bonding elements, upper and lower chips, and a mask. The aligning unit incorporates an aligning detector and a first focusing detector, which work together to ensure accurate alignment and bonding of the chips.

Another significant patent is the "Packaging unit for liquid sample loading devices applied in electron microscope." This invention allows for the easy, rapid, precise, and stable alignment and packaging of liquid sample loading devices. The design includes an engagement of an upper jig and a bottom jig, along with a first fixing pillar supported in a slide track. This innovation improves the efficiency and yield of packaging while maintaining the original state of the liquid sample.

Career Highlights

Shih-Wen Tseng is affiliated with National Cheng-Kung University, where he continues to advance research in chip packaging technologies. His work has garnered attention for its practical applications in various electronic devices.

Collaborations

He collaborates with esteemed colleagues such as Wei-Min Zhang and Yun-Chorng Chang, contributing to a dynamic research environment that fosters innovation.

Conclusion

Shih-Wen Tseng's contributions to chip packaging technology exemplify the importance of innovation in the electronics field. His patents reflect a commitment to improving efficiency and precision in manufacturing processes.