Company Filing History:
Years Active: 2001-2003
Title: Innovations of Hui-Pin Chen
Introduction
Hui-Pin Chen is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on enhancing the efficiency and functionality of semiconductor chip packages.
Latest Patents
One of his latest patents is a semiconductor chip package with a cooling arrangement. This innovative design includes a heat sink that covers at least one semiconductor chip. The heat sink features an inverted U-shaped cross-section, creating a recess at its inner bottom to accommodate the chip. Additionally, it has multiple pins extending downward from its lower edge, each designed with a neck, an enlarged head, and an open slot. This configuration allows for rapid heat removal from the semiconductor chip, noise filtering, and reduced inductance. Another significant patent is a method and device for making a metal bump with an increased height. This device consists of a hard conical tubular member with a vertical conical passage and a bell-shaped chamber. The design facilitates the creation of metal bumps, enhancing the manufacturing process.
Career Highlights
Hui-Pin Chen is currently employed at Orient Semiconductor Electronics, Limited, where he continues to innovate in semiconductor technologies. His expertise and inventions have contributed to advancements in the industry, making him a valuable asset to his company.
Collaborations
Hui-Pin Chen has collaborated with talented coworkers, including Ning Huang and Chia-Chieh Hu. Their combined efforts have led to the development of cutting-edge technologies in the semiconductor field.
Conclusion
Hui-Pin Chen's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His innovative designs continue to shape the future of the industry.