The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2003
Filed:
Nov. 19, 2001
Wen-Lo Shieh, Taipei, TW;
Ning Huang, Taipei, TW;
Hui-Pin Chen, Taipei, TW;
Hua-Wen Chiang, Taipei, TW;
Chung-Ming Chang, Taipei, TW;
Feng-Chang Tu, Taipei, TW;
Fu-Yu Huang, Taipei, TW;
Hsuan-Jui Chang, Taipei, TW;
Chia-Chieh Hu, Taipei, TW;
Wen-Long Leu, Taipei, TW;
Orient Semiconductor Electronics Limited, Kaohsiung, TW;
Abstract
A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.