Ning Huang

Title: Innovations by Inventor Ning Huang

Introduction

Ning Huang is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of five patents. His work focuses on enhancing the efficiency and performance of semiconductor devices.

Latest Patents

One of his latest patents is a semiconductor chip package with a cooling arrangement. This innovative package includes a heat sink designed to cover at least one semiconductor chip. The heat sink features an inverted U-shaped cross-section, creating a recess at its inner bottom to accommodate the chip. Additionally, it has multiple pins extending downward from its lower edge, each designed with a neck, an enlarged head, and an open slot. This design allows for rapid heat removal from the semiconductor chip, effectively filtering noise and reducing inductance.

Another notable patent is a method and device for making a metal bump with an increased height. This device consists of a hard conical tubular member with a vertical conical passage at the top and a bell-shaped chamber at the bottom. The bell-shaped chamber is larger in diameter than the vertical passage and is connected to a circular recess below it. This configuration forms a capillary tube that enhances the manufacturing process of metal bumps.

Career Highlights

Ning Huang is currently employed at Orient Semiconductor Electronics, Limited, where he continues to innovate in semiconductor technology. His expertise and inventions have significantly impacted the industry, contributing to advancements in device performance and reliability.

Collaborations

Ning has collaborated with several talented individuals, including Hui-Pin Chen and Chia-Chieh Hu, who have contributed to his projects and innovations.

Conclusion

Ning Huang's work in semiconductor technology exemplifies the spirit of innovation. His patents reflect a commitment to improving device efficiency and performance, making him a notable figure in the field.