The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2002
Filed:
Oct. 23, 2000
Wen Lo Shieh, Taipei, TW;
Fu Yu Huang, Taipei, TW;
Yung-Cheng Chuang, Taipei, TW;
Chia-Chieh Hu, Taipei, TW;
Hui-Pin Chen, Taipei, TW;
Ning Huang, Taipei, TW;
Feng Chang Tu, Taipei, TW;
Chung Ming Chang, Taipei, TW;
Hua Wen Chiang, Taipei, TW;
Hsuan Jui Chang, Taipei, TW;
Orient Semiconductor Electronics Limited, Kaohsiung, TW;
Abstract
A method of forming cylindrical bumps on a substrate for integrated circuits includes the steps of: forming copper circuits on a board of a substrate by means of electroplating; covering said board with a screening material; forming openings in said screening material to align with copper circuits on said board, filling pure copper or high melting point metal into said openings by electroplating to form cylindrical projections; forming a layer of solder alloy on an upper end of each of said cylindrical projections to be even with an upper surface of said screening material, and removing said screening material to leave the cylindrical bumps, whereby the engagement operation between the die and the substrate can be facilitated and the manufacture of the die can be easier.