Company Filing History:
Years Active: 2001-2002
Title: Yung-Cheng Chuang: Innovator in Integrated Circuit Technology
Introduction
Yung-Cheng Chuang is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of integrated circuits, holding a total of three patents. His innovative methods have advanced the manufacturing processes in semiconductor technology.
Latest Patents
One of Yung-Cheng Chuang's latest patents is a method of forming cylindrical bumps on a substrate for integrated circuits. This method involves several steps, including forming copper circuits on a substrate through electroplating, covering the board with a screening material, and creating openings to align with the copper circuits. The process continues with filling these openings with pure copper or high melting point metal, forming cylindrical projections, and applying a layer of solder alloy to facilitate the engagement between the die and the substrate.
Another notable patent is a method of forming bumps on wafers or substrates. This method includes adhering a heat-resistant synthetic tape to the wafer, punching holes to create blind holes above the under-bump-metallurgy layer, and filling solder paste into these holes. The solder paste is then melted and cooled to form a solder block, which is later melted again to create a ball-shaped solder bump.
Career Highlights
Yung-Cheng Chuang is currently employed at Orient Semiconductor Electronics, Limited, where he continues to innovate in the semiconductor industry. His work has been instrumental in improving the efficiency and effectiveness of integrated circuit manufacturing.
Collaborations
Yung-Cheng has collaborated with notable coworkers, including Fu Yu Huang and Hsuan Jui Chang, contributing to various projects that enhance semiconductor technologies.
Conclusion
Yung-Cheng Chuang's contributions to integrated circuit technology through his patents and work at Orient Semiconductor Electronics, Limited, highlight his role as a key innovator in the field. His methods for forming bumps on substrates and wafers are paving the way for advancements in semiconductor manufacturing.