The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2002
Filed:
Oct. 16, 2000
Wen Lo Shieh, Taipei, TW;
Fu Yu Huang, Taipei, TW;
Yung-Cheng Chuang, Taipei, TW;
Hsuan Jui Chang, Taipei, TW;
Hui-Pin Chen, Taipei, TW;
Ning Huang, Taipei, TW;
Feng-Chang Tu, Taipei, TW;
Chung-Ming Chang, Taipei, TW;
Hua Wen Chiang, Taipei, TW;
Chia-Chieh Hu, Taipei, TW;
Orient Semiconductor Electronics Limited, Kaohsiung, TW;
Abstract
A method of forming metal bumps on a wafer includes the steps of adhering a heat-resistant and steady synthetic tape on the top of the wafer, punching holes through the synthetic tape to form a blind hole on the synthetic tape above the under-bump-metallurgy layer (UBM), filling solder paste into the blind hole by a pusher, melting and then cooling the solder paste into a solder block removing the synthetic tape to expose the solder block, and melting the solder block to form a ball-shaped solder bump.