Company Filing History:
Years Active: 2002-2003
Title: Innovations by Feng-Chang Tu
Introduction
Feng-Chang Tu is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of three patents. His work focuses on enhancing the efficiency and performance of semiconductor devices.
Latest Patents
One of his latest patents is a semiconductor chip package with a cooling arrangement. This innovative package includes a heat sink designed to cover at least one semiconductor chip. The heat sink features an inverted U-shaped cross-section, creating a recess at its inner bottom to accommodate the chip. Additionally, it has multiple pins extending downward from its lower edge, each designed with a neck, an enlarged head, and an open slot. This design allows for rapid heat removal from the semiconductor chip, effectively filtering noise and reducing inductance. Another significant patent is a method and device for making a metal bump with increased height. This device consists of a hard conical tubular member with a vertical conical passage at the top and a bell-shaped chamber at the bottom. The design facilitates the creation of metal bumps, enhancing the manufacturing process in semiconductor applications.
Career Highlights
Feng-Chang Tu is currently employed at Orient Semiconductor Electronics, Limited. His work at this company has allowed him to develop and refine his innovative ideas in semiconductor technology. His contributions have been instrumental in advancing the capabilities of semiconductor devices.
Collaborations
Feng-Chang Tu has collaborated with notable coworkers, including Ning Huang and Hui-Pin Chen. Their teamwork has fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies in the semiconductor field.
Conclusion
Feng-Chang Tu's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in semiconductor design and manufacturing.