Orient Semiconductor Electronics, Limited

Feng-Chang Tu

Chia-Chieh Hu

Ning Huang

Hui-Pin Chen

Chung-Ming Chang

Fu-Yu Huang

Wen-Lo Shieh

Hua-Wen Chiang

Hsuan-Jui Chang

Wen-Long Leu

Yung-Cheng Chuang

Fu Yu Huang

Hua Wen Chiang

Hsuan Jui Chang

Wen Lo Shieh

A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.

Semiconductor chip package with cooling arrangement

A device for making metal bumps includes a hard conical tubular member having a vertical conical passage at an upper portion thereof, a bell shaped chamber at a lower portion thereof which is larger than the vertical conical passage in diameter, located under and communicated with the vertical conical passage, and a circular recess which is larger than the bell shaped chamber in diameter, located under and communicated with the bell shaped chamber, thereby forming a capillary tube with a surface.

Method and device for making a metal bump with an increased height

A method of forming metal bumps on a wafer includes the steps of adhering a heat-resistant and steady synthetic tape on the top of the wafer, punching holes through the synthetic tape to form a blind hole on the synthetic tape above the under-bump-metallurgy layer (UBM), filling solder paste into the blind hole by a pusher, melting and then cooling the solder paste into a solder block removing the synthetic tape to expose the solder block, and melting the solder block to form a ball-shaped solder bump.

Method of forming bumps on wafers or substrates

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Taipei, Taiwan

Feng-Chang Tu