Company Filing History:
Years Active: 2001-2002
Title: Hsuan Jui Chang: Innovator in Integrated Circuit Technology
Introduction
Hsuan Jui Chang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of integrated circuits, holding three patents that showcase his innovative methods in semiconductor technology.
Latest Patents
One of his latest patents is titled "Method of forming cylindrical bumps on a substrate for integrated circuits." This method involves several steps, including forming copper circuits on a substrate through electroplating, covering the board with a screening material, and creating openings to align with the copper circuits. The process continues with filling these openings with pure copper or high melting point metal to form cylindrical projections. A layer of solder alloy is then formed on the upper end of each projection, facilitating the engagement operation between the die and the substrate.
Another significant patent is the "Method of forming bumps on wafers or substrates." This method includes adhering a heat-resistant synthetic tape to the top of a wafer, punching holes to create blind holes above the under-bump-metallurgy layer, and filling solder paste into these holes. The solder paste is then melted and cooled to form a solder block, which is later melted again to create a ball-shaped solder bump.
Career Highlights
Hsuan Jui Chang is currently employed at Orient Semiconductor Electronics Limited, where he continues to develop innovative solutions in semiconductor manufacturing. His work has been instrumental in advancing the technology used in integrated circuits.
Collaborations
Hsuan collaborates with talented individuals such as Fu Yu Huang and Yung-Cheng Chuang, contributing to a dynamic team focused on innovation in the semiconductor industry.
Conclusion
Hsuan Jui Chang's contributions to integrated circuit technology through his patents and collaborative efforts highlight his role as a key innovator in the field. His work continues to influence advancements in semiconductor manufacturing.