For the Inventor, By the Inventor

Enter assignee name

Taichung, Taiwan

IV Technologies Co., Ltd.

USPTO Granted Patents = 40

Trademarks = 2

Forward Citations = 110

Loading Chart...

Loading Chart...

28 inventors (with patents filed for the assignee):

Yu-Piao Wang (18 out of 21 patents)

Wen-Chang Shih (13 out of 14 patents)

Yung-Chung Chang (10 out of 10 patents)

4. Min-Kuei Chu (8 out of 8 patents)

5. Kun-Che Pai (7 out of 7 patents)

6. Yu-Hao Pan (5 out of 5 patents)

7. Lung-Chen Wei (4 out of 4 patents)

8. Shiuan-Tzung Li (3 out of 3 patents)

9. Chao-Chin Wang (3 out of 3 patents)

10. Chung-Ru Wu (2 out of 2 patents)

11. I-Ping Chen (2 out of 2 patents)

12. Ching-Huang Shen (2 out of 2 patents)

13. Wei-Wen Yang (2 out of 2 patents)

14. Shen-Yu Chang (2 out of 2 patents)

15. Chun-Ming Ting (1 out of 1 patent)

Core Competencies:

Polishing Pad

Polishing Method

Manufacturing Method

Polishing Layer

Substrate Retaining Ring

CMP

Detection Window

Inlaid Polishing Pad

Single-Layer Polishing Pad

Fabricating Method

Polishing System

Grooved Window

40 patents: Sort by Forward Citations

1. 12420375 - Polishing pad and polishing method (2025-09-23),

2. 11872671 - Polishing pad and polishing method (2024-01-16),

3. 11858089 - Polishing layer and polishing method (2024-01-02),

4. 11850701 - Polishing pad, manufacturing method of polishing pad and polishing method (2023-12-26),

5. 11541505 - Polishing pad, manufacturing method of polishing pad and polishing method (2023-01-03),

6. 11524389 - Polishing pad and polishing method (2022-12-13),

7. 11498181 - Polishing pad and manufacturing method of polishing pad and polishing method (2022-11-15),

8. 10828745 - Polishing pad and polishing method (2020-11-10),

9. 10518386 - Polishing pad and polishing method (2019-12-31),

10. 10478940 - Manufacturing method of polishing layer, and polishing method (2019-11-19),

11. 10421173 - Base layer, polishing pad with base layer, and polishing method (2019-09-24),

12. 10239182 - Polishing pad and polishing method (2019-03-26),

13. 10040167 - Polishing pad, polishing system and polishing method (2018-08-07),

14. 9969049 - Polishing layer of polishing pad and method of forming the same and polishing method (2018-05-15),

15. RE46648 - Polishing pad, polishing method and method of forming polishing pad (2017-12-25),

Company Overview

IV Technologies Co., Ltd., based in Taichung, Taiwan, specializes in advanced polishing technologies essential for semiconductor manufacturing. The company focuses on the development and production of polishing pads, methods, and related components that enhance the chemical mechanical polishing (CMP) process. Their innovations include inlaid polishing pads and substrate retaining rings, which are critical for achieving high precision in surface finishing. IV Technologies is committed to advancing CMP technology to meet the evolving needs of the semiconductor industry.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

40 Patents

#49 in Taichung

#480 in Taiwan

#17,087 in the World

Taichung, Taiwan

IV Technologies Co., Ltd.

Forward Citations = 110

28 inventors:

Yu-Piao Wang (18 out of 21 patents)

Wen-Chang Shih (13 out of 14 patents)

Yung-Chung Chang (10 out of 10 patents)

4. Min-Kuei Chu (8 out of 8 patents)

5. Kun-Che Pai (7 out of 7 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: IV Technologies Co., Ltd.. Retrieved from https://idiyas.com/company/iv-technologies-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

Loading…