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For the Inventor, By the Inventor

Taipei, Taiwan

Yung-Chung Chang

This inventor holds 10 USPTO granted patents. Top assignee: IV Technologies Co., Ltd.. Active years: 2006-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yung-Chung Chang. Retrieved from https://idiyas.com/inventor/yung-chung-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 5

Forward Citations = 54(Granted Patents)


Company Filing History:

goldMedal10 out of 40 
 
IV Technologies Co., Ltd.
 patents

Years Active: 2006-2013

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10 patents (USPTO):Explore Patents
1. 8480773 - Method of fabricating a polishing pad (2013-07-09),
2. 8016647 - Polishing pad and method thereof (2011-09-13),
3. 7875335 - Method of fabricating polishing pad having detection window thereon (2011-01-25),
4. 7335094 - Single-layer polishing pad and method of producing the same (2008-02-26),
5. 7285233 - Method of manufacturing polishing pad (2007-10-23),
6. 7258602 - Polishing pad having grooved window therein and method of forming the same (2007-08-21),
7. 7241408 - Method of fabricating polishing pad having detection window thereon (2007-07-10),
8. 7132070 - Method of manufacturing polishing pad (2006-11-07),
9. 7131901 - Polishing pad and fabricating method thereof (2006-11-07),
10. 7101501 - Single-layer polishing pad and method producing the same (2006-09-05),

Title: Yung-Chung Chang: Innovator in Polishing Pad Technology

Introduction

Yung-Chung Chang is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of polishing pad technology, holding a total of 10 patents. His innovative approaches have advanced the manufacturing processes and functionality of polishing pads used in various applications.

Latest Patents

Chang's latest patents include a method of fabricating a polishing pad. This invention involves creating a polishing pad with a compressibility-aiding stripe embedded within it. The process consists of assembling the stripe in a mold cavity, filling the cavity with a polymer material, and subsequently releasing the polishing pad from the mold. Another notable patent is for a polishing pad that features a compressibility-aiding stripe, which is also buried in the polishing pad body. This stripe possesses a greater compressibility than the pad itself, enhancing its performance.

Career Highlights

Yung-Chung Chang has established himself as a key figure in his field through his innovative work at Iv Technologies Co., Ltd. His expertise in polishing pad technology has led to advancements that benefit various industries, particularly in semiconductor manufacturing and surface finishing.

Collaborations

Chang has collaborated with notable colleagues, including Wen-Chang Shih and Min-Kuei Chu. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Yung-Chung Chang's contributions to polishing pad technology exemplify his innovative spirit and dedication to advancing manufacturing processes. His patents reflect a commitment to improving product performance and functionality in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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