The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Jan. 12, 2018
Applicant:

Iv Technologies Co., Ltd., Taichung, TW;

Inventors:

Chung-Ru Wu, Kaohsiung, TW;

Yu-Hao Pan, Taichung, TW;

Kun-Che Pai, Taichung, TW;

Chun-Ming Ting, Yunlin County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/22 (2012.01); B24B 37/24 (2012.01); B24D 11/02 (2006.01); B24B 37/04 (2012.01);
U.S. Cl.
CPC ...
B24B 37/22 (2013.01); B24B 37/042 (2013.01); B24B 37/24 (2013.01); B24D 11/02 (2013.01);
Abstract

A polishing pad is provided. The polishing pad, disposed on a polishing platen and suitable for a polishing process, includes a polishing layer, an adhesive layer and at least one adhesion-reducing interface layer. The adhesive layer is disposed between the polishing layer and the polishing platen. The at least one adhesion-reducing interface layer is disposed between the adhesive layer and the polishing layer and/or disposed between the adhesive layer and the polishing platen. An area of the at least one adhesion-reducing interface layer is smaller than an area of the adhesive layer.


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