Chung-Ru Wu

Title: Innovations by Chung-Ru Wu

Introduction

Chung-Ru Wu is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of polishing technology, holding two patents that showcase his innovative approach to improving polishing processes.

Latest Patents

Wu's latest patents include a polishing pad and polishing method designed to enhance the efficiency of polishing objects. The first patent describes a polishing pad that features a polishing layer with a rough bottom surface containing a plurality of discontinuous dents. This design aims to optimize the polishing process by improving adhesion and effectiveness. The second patent also focuses on a polishing pad, which includes an adhesive layer and at least one adhesion-reducing interface layer. This innovative structure is intended to facilitate a smoother polishing process by reducing unwanted adhesion between the polishing pad and the polishing platen.

Career Highlights

Chung-Ru Wu is associated with Iv Technologies Co., Ltd., where he applies his expertise in polishing technology. His work has contributed to advancements in the industry, making polishing processes more efficient and effective.

Collaborations

Wu has collaborated with notable colleagues, including Kun-Che Pai and Yu-Hao Pan. Their combined efforts have fostered innovation and development in their respective fields.

Conclusion

Chung-Ru Wu's contributions to polishing technology through his patents reflect his commitment to innovation and improvement in manufacturing processes. His work continues to influence the industry positively.