Kun-Che Pai is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of polishing technology, holding a total of 7 patents. His work focuses on developing advanced polishing pads and methods that enhance the efficiency and effectiveness of polishing processes.

Latest Patents

Among his latest patents, Kun-Che Pai has developed a polishing pad adapted for polishing an object, which features a polishing track region. This innovative polishing pad includes a polishing layer and an adhesive layer. The polishing layer has a polishing surface and a rough bottom surface, which contains a plurality of discontinuous dents. The adhesive layer is firmly adhered to the rough bottom surface. Another notable patent involves a polishing pad suitable for a polishing process, which consists of a polishing layer, an adhesive layer, and at least one adhesion-reducing interface layer. This design improves the interaction between the polishing pad and the polishing platen, enhancing the overall polishing performance.

Career Highlights

Kun-Che Pai is currently associated with Iv Technologies Co., Ltd., where he continues to innovate and develop new technologies in the polishing industry. His expertise and dedication have positioned him as a key figure in his field.

Collaborations

Throughout his career, Kun-Che Pai has collaborated with talented individuals such as Yu-Hao Pan and Shiuan-Tzung Li. These collaborations have contributed to the advancement of polishing technologies and have fostered a creative environment for innovation.

Conclusion

Kun-Che Pai's contributions to polishing technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively, showcasing the importance of innovation in enhancing manufacturing processes.

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