The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
Aug. 22, 2018
Applicant:
Iv Technologies Co., Ltd., Taichung, TW;
Inventor:
Yu-Piao Wang, Hsinchu County, TW;
Assignee:
IV Technologies CO., Ltd., Taichung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/20 (2012.01); B24B 49/12 (2006.01); B24B 37/013 (2012.01);
U.S. Cl.
CPC ...
B24B 37/205 (2013.01); B24B 37/013 (2013.01); B24B 49/12 (2013.01);
Abstract
A polishing pad including a polishing layer and at least one detection window is provided. The polishing layer includes a polishing surface and a back surface having at least one protrusion. The at least one detection window is disposed at a location corresponding to the at least one protrusion in the polishing layer, and the at least one protrusion surrounds the at least one detection window. A manufacturing method and a polishing method of the polishing pad are also provided.
Wang, Yu-Piao. (2022). Polishing pad and manufacturing method of polishing pad and polishing method (U.S. Patent No. 11498181). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11498181
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile