The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Apr. 17, 2019
Applicant:
Iv Technologies Co., Ltd., Taichung, TW;
Inventors:
Yu-Piao Wang, Hsinchu County, TW;
I-Ping Chen, Tainan, TW;
Assignee:
IV Technologies CO., Ltd., Taichung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/22 (2012.01); B24D 11/00 (2006.01); B24B 37/24 (2012.01);
U.S. Cl.
CPC ...
B24B 37/22 (2013.01); B24D 11/001 (2013.01); B24D 11/008 (2013.01); B24B 37/24 (2013.01);
Abstract
A polishing pad is provided. The polishing pad comprises a polishing layer and a metal-containing layer. The polishing layer has a polishing surface and a backside surface opposite to each other, wherein the backside surface has a plurality of cavities. The metal-containing layer is disposed on the backside surface of the polishing layer and fills into the cavities, wherein a first contact area is between the metal-containing layer and the backside surface of the polishing layer, and the first contact area is larger than the orthogonal projection area of the polishing layer.