Taipei, Taiwan

Wei-Wen Yang

USPTO Granted Patents = 2 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2013-2017

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2 patents (USPTO):Explore Patents

Title: Innovations of Wei-Wen Yang

Introduction

Wei-Wen Yang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of polishing pad technology, holding two patents that showcase his innovative approach to manufacturing.

Latest Patents

Wei-Wen Yang's latest patents include a method of manufacturing a polishing pad with a detection window. This invention provides a polishing pad that features a detection window, enhancing its functionality. The process involves pre-disposing a dummy detection window in a mold, filling the mold with a polishing layer precursor, and performing a solidifying process to create a polishing layer. The polishing layer and the dummy detection window are designed to be completely separable, allowing for the formation of a detection opening in the polishing layer. Alternatively, the detection opening can be created using a mold with a protrusion structure. A detection window precursor is then filled into the detection opening, followed by another solidifying process to form the detection window.

Career Highlights

Wei-Wen Yang is currently employed at Iv Technologies Co., Ltd., where he continues to develop innovative solutions in his field. His work has contributed to advancements in polishing pad technology, making him a valuable asset to his company.

Collaborations

Throughout his career, Wei-Wen Yang has collaborated with talented individuals such as Kun-Che Pai and Shiuan-Tzung Li. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Wei-Wen Yang's contributions to polishing pad technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of manufacturing in this field.

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