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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11858089 B1

PDFFull Text
Date of Patent:
Jan. 02, 2024

Filed:

Oct. 16, 2019

Polishing layer and polishing method

Applicant:

Iv Technologies Co., Ltd., Taichung, TW;

Inventors:

Yu-Hao Pan, Taichung, TW;

Ching-Huang Shen, Taichung, TW;

Yu-Piao Wang, Hsinchu County, TW;

Assignee:

IV Technologies CO., Ltd., Taichung, TW;

Attorney:

JCIPRNET

Primary Examiner:

Lee D Wilson

Assistant Examiner:

Shantese L McDonald

Int. Cl.
CPC ...
B24B 37/26 (2012.01); B24D 18/00 (2006.01); B24B 37/22 (2012.01); B29C 43/02 (2006.01); B29C 43/36 (2006.01); B29L 9/00 (2006.01);
U.S. Cl.
CPC ...
B24B 37/26 (2013.01); B24B 37/22 (2013.01); B24D 18/0009 (2013.01); B24D 18/0045 (2013.01); B29C 43/021 (2013.01); B29C 43/36 (2013.01); B29C 2043/023 (2013.01); B29C 2043/3634 (2013.01); B29C 2793/009 (2013.01); B29C 2793/0027 (2013.01); B29L 2009/00 (2013.01);
Abstract

A polishing layer is provided. The polishing layer have a surface pattern, a cross section of the surface pattern along a direction has a plurality of grooves and a plurality of polishing portions, each of the grooves is disposed between every two adjacent polishing portions, and the polishing layer comprises a body layer and a surface layer. The surface layer is disposed on a surface of the body layer, and a top of at least one of the polishing portions has at least one flattened region exposing the body layer.

Find Patent Forward Citations

Pan, Yu-Hao. (2024). Polishing layer and polishing method (U.S. Patent No. 11858089). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11858089

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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