The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Dec. 08, 2017
Applicant:
Iv Technologies Co., Ltd., Taichung, TW;
Inventors:
Yu-Piao Wang, Hsinchu County, TW;
I-Ping Chen, Tainan, TW;
Assignee:
IV Technologies CO., Ltd., Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 3/34 (2006.01); B24D 3/34 (2006.01); B24B 55/02 (2006.01); B24B 29/02 (2006.01); B24B 37/24 (2012.01); B24B 37/34 (2012.01); B24B 37/26 (2012.01);
U.S. Cl.
CPC ...
B24D 3/346 (2013.01); B24B 29/02 (2013.01); B24B 37/24 (2013.01); B24B 37/26 (2013.01); B24B 37/34 (2013.01); B24B 55/02 (2013.01);
Abstract
A polishing pad is provided. The polishing pad, suitable for a polishing procedure using a slurry containing water, includes a polishing track region and a first reactant. The polishing track region includes a central region and a peripheral region surrounding the central region. The first reactant is disposed in the central region of the polishing track region, wherein the first reactant is able to react endothermically with the water in the slurry.