For the Inventor, By the Inventor

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Hsinchu, Taiwan

Chipbond Technology Corporation

USPTO Granted Patents = 92

EPO Patents = 3

Forward Citations = 87

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109 inventors (with patents filed for the assignee):

Chin-Tang Hsieh (26 out of 26 patents)

Chih-Ming Kuo (22 out of 23 patents)

Cheng-Hung Shih (17 out of 17 patents)

4. Lung-Hua Ho (17 out of 17 patents)

5. Chun-Te Lee (14 out of 14 patents)

6. Gwo-Shyan Sheu (11 out of 11 patents)

7. Yu-Chen Ma (10 out of 10 patents)

8. Hui-Yu Huang (10 out of 10 patents)

9. You-Ming Hsu (10 out of 10 patents)

10. Chih-Ming Peng (9 out of 9 patents)

11. Chia-Jung Tu (9 out of 9 patents)

12. Hsin-Hao Huang (8 out of 10 patents)

13. Shih-Chieh Chang (8 out of 8 patents)

14. Wen-Fu Chou (7 out of 7 patents)

15. Yin-Chen Lin (6 out of 6 patents)

Core Competencies:

Flip Chip Bonding

Flexible Circuit Board

Semiconductor Package

Bumping Process

Thin Film Circuit

3D Inductor

Heat Dissipation

Electronic Package

Layout Structure

Substrate Structure

Surface Acoustic Wave Device

Manufacturing Method

92 patents: Sort by Forward Citations

1. 12707564 - Flexible circuit board (2026-08-11),

2. 12685204 - Chip on film package with multilayer composite bumps bonded to multiple leads on a substrate (2026-07-14),

3. 12635586 - Semiconductor package (2026-05-19),

4. 12628273 - Flexible circuit tape and flexible circuit board thereof (2026-05-12),

5. 12588541 - Flip chip bonding method and chip used therein (2026-03-24),

6. 12564056 - Inner lead structure of flexible circuit board (2026-02-24),

7. 12550764 - Layout structure of flexible circuit board (2026-02-10),

8. 12543581 - Flip-chip bonding structure and substrate thereof (2026-02-03),

9. 12543265 - Semiconductor package and chip thereof (2026-02-03),

10. 12543262 - Thin film circuit board (2026-02-03),

11. 12538805 - Semiconductor package and method of manufacturing the same (2026-01-27),

12. 12525481 - Clamp assembly (2026-01-13),

13. 12464639 - Semiconductor package having flow-guiding grooves and circuit board thereof (2025-11-04),

14. 12456673 - Flip chip package and substrate thereof (2025-10-28),

15. 12432849 - Flip-chip bonding structure and circuit board thereof (2025-09-30),

Chipbond Technology Corporation is a leading provider of integrated optoelectronics and semiconductor packaging and testing services. With over two decades of experience, the company offers reliable and high-performance solutions for various industries. Chipbond's products and services include LCD driver ICs, touch controllers, wafer-level packaging, testing, and more. As a trusted partner for many global brands, Chipbond is committed to delivering innovative solutions that enhance the performance and competitiveness of their customers' products.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 15 2026

92 Patents

#67 in Hsinchu

#254 in Taiwan

#8,344 in the World

Hsinchu, Taiwan

Chipbond Technology Corporation

Forward Citations = 87

109 inventors:

Chin-Tang Hsieh (26 out of 26 patents)

Chih-Ming Kuo (22 out of 23 patents)

Cheng-Hung Shih (17 out of 17 patents)

4. Lung-Hua Ho (17 out of 17 patents)

5. Chun-Te Lee (14 out of 14 patents)

Please report any incorrect information to [email protected]

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