Chipbond Technology Corporation, based in Hsinchu, Taiwan, specializes in advanced semiconductor packaging solutions. The company focuses on innovative technologies such as flip chip bonding and flexible circuit boards, catering to the evolving demands of the electronics industry. Their expertise extends to various core areas, including semiconductor packages, bumping processes, thin film circuits, and 3D inductors, emphasizing efficient heat dissipation and compact electronic packaging. Chipbond is committed to enhancing the performance and reliability of electronic devices through its cutting-edge technologies.

Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 6 2026

94 Patents

#68 in Hsinchu

#253 in Taiwan

#8,185 in the World

Hsinchu, Taiwan

Chipbond Technology Corporation

Forward Citations = 87

114 inventors:

Chin-Tang Hsieh (26 out of 26 patents)

Chih-Ming Kuo (22 out of 23 patents)

Cheng-Hung Shih (17 out of 17 patents)

4. Lung-Hua Ho (17 out of 17 patents)

5. Chun-Te Lee (14 out of 14 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Chipbond Technology Corporation. Retrieved from https://idiyas.com/company/chipbond-technology

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

3 patents (EPO):

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]