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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chipbond Technology Corporation


USPTO Granted Patents = 79


Forward Citations = 80

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90 inventors (with patents filed for the assignee):

goldMedal Chin-Tang Hsieh (23 out of 23 patents)

silverMedal Chih-Ming Kuo (20 out of 21 patents)

bronzeMedal Cheng-Hung Shih (17 out of 17 patents)

4.  Lung-Hua Ho (14 out of 14 patents)

5.  Chun-Te Lee (12 out of 12 patents)

6.  Gwo-Shyan Sheu (10 out of 10 patents)

7.  Hui-Yu Huang (10 out of 10 patents)

8.  You-Ming Hsu (10 out of 10 patents)

9.  Yu-Chen Ma (9 out of 9 patents)

10.  Chih-Ming Peng (9 out of 9 patents)

11.  Chia-Jung Tu (9 out of 9 patents)

12.  Hsin-Hao Huang (8 out of 10 patents)

13.  Shih-Chieh Chang (8 out of 8 patents)

14.  Wen-Fu Chou (7 out of 7 patents)

15.  Yin-Chen Lin (6 out of 6 patents)


Core Competencies:
Semiconductor Package
Flip Chip Package
Flexible Circuit Board
Surface Acoustic Wave Device
Heat Dissipation Package
3D Inductor
Wafer Dicing Method
Electroplating System
Chip on Film Package
Circuit Board Layout
Manufacturing Method
Storage Device

79 patents:

1. 12464639 - Semiconductor package having flow-guiding grooves and circuit board thereof (2025-11-04),
2. 12456673 - Flip chip package and substrate thereof (2025-10-28),
3. 12432849 - Flip-chip bonding structure and circuit board thereof (2025-09-30),
4. 12424551 - Semiconductor structure and method of manufacturing the same (2025-09-23),
5. 12412825 - Semiconductor package (2025-09-09),
6. 12317462 - Electronic package and method of manufacturing the same (2025-05-27),
7. 12224734 - Surface acoustic wave device and method of manufacturing the same (2025-02-11),
8. 12224183 - Method of manufacturing semiconductor device (2025-02-11),
9. 12089326 - Double-sided flexible circuit board (2024-09-10),
10. 11812554 - Layout structure of a flexible circuit board (2023-11-07),
11. 11792923 - Storage device for flexible circuit packages and carrier thereof (2023-10-17),
12. 11764090 - Tray (2023-09-19),
13. 11651974 - Semiconductor package and method of fabricating the same (2023-05-16),
14. 11606860 - Flexible circuit board (2023-03-14),
15. 11602047 - Circuit board tape and joining method thereof (2023-03-07),
Chipbond Technology Corporation is a leading provider of integrated optoelectronics and semiconductor packaging and testing services. With over two decades of experience, the company offers reliable and high-performance solutions for various industries. Chipbond's products and services include LCD driver ICs, touch controllers, wafer-level packaging, testing, and more. As a trusted partner for many global brands, Chipbond is committed to delivering innovative solutions that enhance the performance and competitiveness of their customers' products.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 30 2025

79 Patents

#45 in Hsinchu

#272 in Taiwan

#9,199 in the World

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Hsinchu, Taiwan

Chipbond Technology Corporation

Forward Citations = 80

90 inventors:

goldMedal Chin-Tang Hsieh (23 out of 23 patents)

silverMedal Chih-Ming Kuo (20 out of 21 patents)

bronzeMedal Cheng-Hung Shih (17 out of 17 patents)

4.  Lung-Hua Ho (14 out of 14 patents)

5.  Chun-Te Lee (12 out of 12 patents)

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