The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2025
Filed:
Aug. 26, 2022
Chipbond Technology Corporation, Hsinchu, TW;
Shrane-Ning Jenq, Hsinchu County, TW;
Wen-Cheng Hsu, Hsinchu County, TW;
Chen-Yu Wang, Hsinchu, TW;
Chih-Ming Kuo, Hsinchu County, TW;
Chwan-Tyaw Chen, Hsinchu, TW;
Lung-Hua Ho, Hsinchu, TW;
CHIPBOND TECHNOLOGY CORPORATION, Hsinchu, TW;
Abstract
A package including a first carrier, a seed layer, wires, a die and a molding material is provided. The first carrier is removed to expose the seed layer after disposing a second carrier on the molding material, then the seed layer is removed to expose the wires, and a gold layer is deposited on each of the wires by immersion gold plating, finally a semiconductor device is obtained. The gold layer is provided to protect the wires from oxidation and improve solder joint reliability.