Chwan-Tyaw Chen

Title: Innovations by Chwan-Tyaw Chen in Semiconductor Manufacturing

Introduction

Chwan-Tyaw Chen is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor manufacturing. His innovative approach has led to the development of a unique method that enhances the reliability of semiconductor devices.

Latest Patents

Chwan-Tyaw Chen holds a patent for a method of manufacturing semiconductor devices. This patent describes a package that includes a first carrier, a seed layer, wires, a die, and a molding material. The process involves removing the first carrier to expose the seed layer after placing a second carrier on the molding material. Subsequently, the seed layer is removed to reveal the wires, and a gold layer is deposited on each wire through immersion gold plating. This gold layer serves to protect the wires from oxidation and improve solder joint reliability. He has 1 patent to his name.

Career Highlights

Chwan-Tyaw Chen is associated with Chipbond Technology Corporation, where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the manufacturing processes within the company.

Collaborations

Chwan-Tyaw Chen has collaborated with notable colleagues, including Shrane-Ning Jenq and Wen-Cheng Hsu. Their combined efforts contribute to the innovative environment at Chipbond Technology Corporation.

Conclusion

Chwan-Tyaw Chen's contributions to semiconductor manufacturing exemplify the importance of innovation in technology. His patented method not only enhances device reliability but also showcases the potential for advancements in the semiconductor industry.