This inventor holds 23 USPTO granted patents and 11 published patent applications, primarily in Semiconductor Packaging. Top assignees: Chipbond Technology Corporation, Amic Technology Corporation. Active years: 2013-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Xinfeng Township, Hsinchu County, TW (2013)
- Xingfeng Township, Hsinchu County, TW (2014)
- Hsinchu, TW (2014 - 2016)
- Hsinchu County, TW (2013 - 2023)
Company Filing History:
Years Active: 2013-2026
Areas of Expertise:
Title: Innovations in Semiconductor Technology by Chih-Ming Kuo
Introduction
Chih-Ming Kuo, an accomplished inventor based in Hsinchu County, Taiwan, has made significant contributions to semiconductor technology. With a portfolio of 20 patents to his name, Kuo's work reflects the forefront of innovation in semiconductor manufacturing processes.
Latest Patents
Among his latest patents, Kuo has developed a unique method for manufacturing semiconductor devices. This process involves a package that includes a first carrier, a seed layer, wires, a die, and a molding material. Upon disposing a second carrier on the molding material, the first carrier is removed to expose the seed layer. The seed layer is subsequently taken out to reveal the wires, onto which a gold layer is deposited through immersion gold plating. This gold layer plays a vital role in protecting the wires from oxidation and enhancing solder joint reliability.
Additionally, Kuo's patent titled "Semiconductor Package and Method of Fabricating the Same" outlines a method for fabricating semiconductor packages. This method encompasses disposing semiconductor devices on a carrier, forming an encapsulation that covers these devices, and designing a recession in the encapsulation that features both a strengthening portion and a recessed portion. The strengthening portion surrounds the recessed area and is removed in the manufacturing process.
Career Highlights
Chih-Ming Kuo has accumulated extensive experience in the semiconductor industry, having worked with reputable companies such as Chipbond Technology Corporation and Amic Technology Corporation. His commitment to innovation and excellence has established him as a respected figure in the field.
Collaborations
Throughout his career, Kuo has collaborated with talented individuals such as Lung-Hua Ho and Chin-Tang Hsieh. These partnerships have contributed to the successful development of various semiconductor technologies and have enhanced the overall impact of his work.
Conclusion
In summary, Chih-Ming Kuo's innovative approach to semiconductor device manufacturing and his extensive patent portfolio underscore his influential role in the industry. His contributions not only protect vital electronic components but also pave the way for advancements in technology that benefit countless applications worldwide.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile