The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2014
Filed:
Feb. 18, 2011
Chih-hung Wu, Zhubei, TW;
Lung-hua Ho, Hsinchu, TW;
Chih-ming Kuo, Xingfeng Township, Hsinchu County, TW;
Cheng-hung Shih, Lugang Township, Changhua County, TW;
Yie-chuan Chiu, Hsinchu, TW;
Chih-Hung Wu, Zhubei, TW;
Lung-Hua Ho, Hsinchu, TW;
Chih-Ming Kuo, Xingfeng Township, Hsinchu County, TW;
Cheng-Hung Shih, Lugang Township, Changhua County, TW;
Yie-Chuan Chiu, Hsinchu, TW;
Chipbond Technology Corporation, Hsinchu, TW;
Abstract
A pyramid bump structure for electrically coupling to a bond pad on a carrier comprises a conductive block disposed at the bond pad and an oblique pyramid insulation layer covered at one side of the conductive block. The oblique pyramid insulation layer comprises a bottom portion and a top portion, and outer diameter of the oblique pyramid insulation layer is tapered from the bottom portion to the top portion. When the carrier is connected with a substrate and an anisotropic conductive film disposed at the substrate, the pyramid bump structure may rapidly embed into the anisotropic conductive film to raise the flow rate of the anisotropic conductive film. Further, a short phenomenon between adjacent bumps can be avoided to raise the yield rate of package process.