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For the Inventor, By the Inventor

Changhua, Taiwan

Cheng-Hung Shih

This inventor holds 17 USPTO granted patents and 11 published patent applications and 3 EPO patents, primarily in Semiconductor Packaging. Top assignee: Chipbond Technology Corporation. Active years: 2012-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng-Hung Shih. Retrieved from https://idiyas.com/inventor/cheng-hung-shih

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 17 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.2

ph-index = 3

Forward Citations = 30(Granted Patents)


Location History:

  • Zhudong Township, Hsinchu County, TW (2012 - 2013)
  • Lugang Township, Changhua County, TW (2013 - 2014)
  • Changhua County, TW (2013 - 2022)

Company Filing History:

goldMedal17 out of 94 
 
Chipbond Technology Corporation
 patents

Years Active: 2012-2025

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Areas of Expertise:
Surface Acoustic Wave Device
3D Inductor
Electroplating System
Chip Package
Hollow Chamber
Photoresist Strip
Fine-Pitch Bumps
Anti-Oxidant Metal Layer
Bump Structure
Semiconductor Manufacturing
Package Structure
Electronic Devices
17 patents (USPTO):Explore Patents
1. 12224734 - Surface acoustic wave device and method of manufacturing the same (2025-02-11),
2. 11522517 - Surface acoustic wave device and method of manufacturing the same (2022-12-06),
3. 11148864 - Storage container for electronic devices (2021-10-19),
4. 11056555 - Semiconductor device having 3D inductor and method of manufacturing the same (2021-07-06),
5. 10808331 - Electroplating system and pressure device thereof (2020-10-20),
6. 10797213 - Chip package and chip thereof (2020-10-06),
7. 9508676 - Semiconductor package structure having hollow chamber and bottom substrate and package process thereof (2016-11-29),
8. 9230823 - Method of photoresist strip (2016-01-05),
9. 8877629 - Semiconductor manufacturing process and structure thereof (2014-11-04),
10. 8692390 - Pyramid bump structure (2014-04-08),
11. 8581239 - Package structure and semiconductor structure thereof (2013-11-12),
12. 8530344 - Method for manufacturing fine-pitch bumps and structure thereof (2013-09-10),
13. 8501614 - Method for manufacturing fine-pitch bumps and structure thereof (2013-08-06),
14. 8497579 - Semiconductor packaging method and structure thereof (2013-07-30),
15. 8450049 - Process for forming an anti-oxidant metal layer on an electronic device (2013-05-28),

Title: **Innovator Cheng-Hung Shih: Pioneering Surface Acoustic Wave Technology**

Introduction

Cheng-Hung Shih, an accomplished inventor based in Changhua County, Taiwan, has made significant contributions to the field of surface acoustic wave devices. With a remarkable portfolio of 17 patents, he stands out as a key figure in technological innovation.

Latest Patents

One of Cheng-Hung Shih's latest patents is focused on a surface acoustic wave device and its manufacturing method. This innovative device incorporates a piezoelectric substrate, a supportive layer, a cover layer, and a pillar bump. The supportive layer is positioned on the piezoelectric substrate and accommodates a transducer, while the cover layer envelops the supportive layer. Notably, the pillar bump is strategically placed within a lower via hole of the supportive layer and an upper via hole of the cover layer. The upper via hole features a lateral opening on the lateral surface of the cover layer, allowing the pillar bump to protrude through this opening. This design advances the functionality of surface acoustic wave devices, marking a significant step in their development.

Career Highlights

Cheng-Hung Shih is associated with Chipbond Technology Corporation, where he is recognized for his innovative spirit and technical expertise. His dedication to advancing technology through patentable inventions has earned him a reputable standing in the industry.

Collaborations

Throughout his career, Cheng-Hung Shih has collaborated with talented colleagues such as Yung-Wei Hsieh and Shu-Chen Lin. These partnerships foster creative solutions and further enhance the company’s contributions to the field.

Conclusion

Cheng-Hung Shih's work exemplifies the impact of innovation in technology. With 17 patents to his name, his role at Chipbond Technology Corporation and collaborations with other skilled inventors highlight the importance of teamwork in driving technological advancements. His contributions to surface acoustic wave devices are poised to shape the future of this domain.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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