The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2013
Filed:
Mar. 22, 2012
Cheng-hung Shih, Changhua County, TW;
Yung-wei Hsieh, Hsinchu, TW;
Shu-chen Lin, Pingtung County, TW;
Cheng-fan Lin, Hsinchu County, TW;
Hua-an Dai, Kaohsiung, TW;
Cheng-Hung Shih, Changhua County, TW;
Yung-Wei Hsieh, Hsinchu, TW;
Shu-Chen Lin, Pingtung County, TW;
Cheng-Fan Lin, Hsinchu County, TW;
Hua-An Dai, Kaohsiung, TW;
Chipbond Technology Corporation, Hsinchu, TW;
Abstract
A method for manufacturing fine-pitch bumps comprises the steps of providing a silicon substrate; forming a titanium-containing metal layer on the silicon substrate, wherein the titanium-containing metal layer comprises a plurality of first zones and a plurality of second zones; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer to form a plurality of opening slots; forming a plurality of copper bumps at the opening slots, wherein each of the copper bumps comprises a first top surface and a ring surface; heating the photoresist layer to form a plurality of body portions and a plurality of removable portions; etching the photoresist layer; and removing the second zones to enable each of the first zones to form an under bump metallurgy layer having a bearing portion and an extending portion.