Yung-Wei Hsieh

Title: Yung-Wei Hsieh: Innovator in Semiconductor Technology

Introduction

Yung-Wei Hsieh is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of six patents. His innovative work focuses on enhancing semiconductor package structures and manufacturing processes.

Latest Patents

One of Hsieh's latest patents is titled "Semiconductor package structure having hollow chamber and bottom substrate and package process thereof." This invention describes a semiconductor package structure that includes a bottom substrate with a bottom baseboard and a bottom metal layer. The design features a hollow chamber formed between the top and bottom substrates, which enhances the performance of the semiconductor package.

Another notable patent is "Semiconductor manufacturing process and structure thereof." This patent outlines a comprehensive manufacturing process that involves several steps, including the formation of a silicon substrate, seed layers, and under bump metallurgy layers. The process aims to improve the efficiency and reliability of semiconductor devices.

Career Highlights

Yung-Wei Hsieh is currently employed at Chipbond Technology Corporation, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor packaging and manufacturing.

Collaborations

Hsieh has collaborated with several talented individuals in his field, including Cheng-Hung Shih and Shu-Chen Lin. These collaborations have contributed to the successful development of his patented technologies.

Conclusion

Yung-Wei Hsieh is a key figure in the semiconductor industry, known for his innovative patents and contributions to technology. His work at Chipbond Technology Corporation and collaborations with other experts highlight his commitment to advancing semiconductor technology.