The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2013
Filed:
Jan. 19, 2012
Cheng-hung Shih, Changhua County, TW;
Shu-chen Lin, Pingtung County, TW;
Yung-wei Hsieh, Hsinchu, TW;
Jun-yu Yeh, Hsinchu County, TW;
Cheng-Hung Shih, Changhua County, TW;
Shu-Chen Lin, Pingtung County, TW;
Yung-Wei Hsieh, Hsinchu, TW;
Jun-Yu Yeh, Hsinchu County, TW;
Chipbond Technology Corporation, Hsinchu, TW;
Abstract
A semiconductor structure comprises a carrier, a plurality of under bump metallurgy layers, a plurality of copper containing bumps and an organic barrier layer, wherein the carrier comprises a protective layer and a plurality of conductive pads, mentioned protective layer comprises a plurality of openings, the conductive pads exposed by the openings, mentioned under bump metallurgy layers being formed on the conductive pads, mentioned copper containing bumps being formed on the under bump metallurgy layers, each of the copper containing bumps comprises a top surface and a ring surface in connection with the top surface, mentioned organic barrier layer having a first coverage portion, and mentioned first coverage portion covers the top surface and the ring surface of each of the copper containing bumps.