This inventor holds 1 USPTO granted patent. Top assignee: Chipbond Technology Corporation. Active years: 2013.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2013
Title: Jun-Yu Yeh: Innovator in Semiconductor Structures
Introduction
Jun-Yu Yeh is a prominent inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that enhances semiconductor structures.
Latest Patents
Jun-Yu Yeh holds a patent for a "Package structure and semiconductor structure thereof." This semiconductor structure includes a carrier, multiple under bump metallurgy layers, copper-containing bumps, and an organic barrier layer. The carrier features a protective layer with openings that expose conductive pads. The under bump metallurgy layers are formed on these conductive pads, while the copper-containing bumps are created on the metallurgy layers. Each bump has a top surface and a ring surface, with the organic barrier layer covering both surfaces.
Career Highlights
Jun-Yu Yeh is associated with Chipbond Technology Corporation, where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the company's capabilities in this competitive field.
Collaborations
He has collaborated with notable colleagues, including Cheng-Hung Shih and Shu-Chen Lin, contributing to various projects within the company.
Conclusion
Jun-Yu Yeh's innovative contributions to semiconductor structures exemplify his commitment to advancing technology in this field. His patent reflects a significant step forward in semiconductor design and functionality.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile