The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2013
Filed:
Mar. 22, 2012
Cheng-hung Shih, Changhua County, TW;
Yung-wei Hsieh, Hsinchu, TW;
Shu-chen Lin, Pingtung County, TW;
Cheng-fan Lin, Hsinchu County, TW;
Hua-an Dai, Kaohsiung, TW;
Cheng-Hung Shih, Changhua County, TW;
Yung-Wei Hsieh, Hsinchu, TW;
Shu-Chen Lin, Pingtung County, TW;
Cheng-Fan Lin, Hsinchu County, TW;
Hua-An Dai, Kaohsiung, TW;
Chipbond Technology Corporation, Hsinchu, TW;
Abstract
A method for manufacturing fine-pitch bumps comprises providing a silicon substrate; forming a titanium-containing metal layer having a plurality of first zones and a plurality of second zones on the silicon substrate; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer; forming a plurality of copper bumps having a plurality of first top surfaces and a plurality of first ring surfaces; heating the photoresist layer to form a plurality of body portions and removable portions; etching the photoresist layer; forming a plurality of bump protection layers on the titanium-containing metal layer, the first top surface and the first ring surface, each of the bump protection layers comprises a bump coverage portion; plating a plurality of gold layers at the bump coverage portion; eventually, removing the second zones to enable each of the first zones to form an under bump metallurgy layer.