Hua-An Dai

Title: Hua-An Dai: Innovator in Fine-Pitch Bump Manufacturing

Introduction

Hua-An Dai is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the development of fine-pitch bumps. With a total of 2 patents, his work has advanced the technology used in electronic devices.

Latest Patents

Hua-An Dai's latest patents focus on methods for manufacturing fine-pitch bumps. The first patent describes a method that involves providing a silicon substrate and forming a titanium-containing metal layer with multiple zones. This process includes creating a photoresist layer, patterning it, and forming copper bumps. The method emphasizes the importance of heating and etching the photoresist layer to achieve the desired bump protection layers. The second patent outlines a similar process, detailing the steps of forming a titanium-containing metal layer and creating copper bumps at opening slots. Both patents aim to enhance the efficiency and effectiveness of under bump metallurgy layers.

Career Highlights

Hua-An Dai is currently employed at Chipbond Technology Corporation, where he continues to innovate in the semiconductor industry. His expertise in fine-pitch bump manufacturing has positioned him as a key player in his field.

Collaborations

Hua-An Dai has collaborated with notable coworkers, including Cheng-Hung Shih and Yung-Wei Hsieh. Their combined efforts contribute to the advancement of technology in their respective areas of expertise.

Conclusion

Hua-An Dai's contributions to the field of semiconductor manufacturing through his innovative patents and collaborations highlight his importance as an inventor. His work continues to influence the development of electronic devices, showcasing the impact of his inventions on the industry.