Cheng-Fan Lin

Title: Cheng-Fan Lin: Innovator in Surface Acoustic Wave Technology

Introduction

Cheng-Fan Lin is a prominent inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of surface acoustic wave devices, holding a total of 5 patents. His work has advanced the technology used in various electronic applications.

Latest Patents

One of Cheng-Fan Lin's latest patents is a surface acoustic wave device and method of manufacturing the same. This innovative device includes a piezoelectric substrate, a supportive layer, a cover layer, and a pillar bump. The supportive layer is strategically placed on the piezoelectric substrate and surrounds a transducer. The cover layer serves to protect the supportive layer, while the pillar bump is positioned within a lower via hole of the supportive layer and an upper via hole of the cover layer. Notably, the upper via hole features a lateral opening located on the lateral surface of the cover layer, allowing the pillar bump to protrude from the lateral surface via this opening.

Career Highlights

Cheng-Fan Lin is currently employed at Chipbond Technology Corporation, where he continues to innovate and develop new technologies. His expertise in surface acoustic wave devices has positioned him as a key player in the industry.

Collaborations

Cheng-Fan Lin has collaborated with notable coworkers, including Cheng-Hung Shih and Yung-Wei Hsieh. Their combined efforts contribute to the advancement of technology within their field.

Conclusion

Cheng-Fan Lin's contributions to surface acoustic wave technology and his innovative patents highlight his role as a leading inventor in the industry. His work continues to influence advancements in electronic applications, showcasing the importance of innovation in technology.