The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2025
Filed:
Jul. 01, 2022
Applicant:
Chipbond Technology Corporation, Hsinchu, TW;
Inventors:
Cheng-Hung Shih, Changhua County, TW;
Cheng-Fan Lin, Hsinchu County, TW;
Assignee:
CHIPBOND TECHNOLOGY CORPORATION, Hsinchu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H03H 3/08 (2006.01); H03H 9/02 (2006.01); H03H 9/05 (2006.01); H03H 9/145 (2006.01); H10N 30/87 (2023.01);
U.S. Cl.
CPC ...
H03H 9/02952 (2013.01); H03H 3/08 (2013.01); H03H 9/02834 (2013.01); H03H 9/059 (2013.01); H03H 9/145 (2013.01); H10N 30/877 (2023.02);
Abstract
A surface acoustic wave device includes a piezoelectric substrate, a supportive layer, a cover layer and a pillar bump. The supportive layer is disposed on the piezoelectric substrate and around a transducer, the cover layer covers the supportive layer, and the pillar bump is located in a lower via hole of the supportive layer and an upper via hole of the cover layer. The upper via hole has a lateral opening located on a lateral surface of the cover layer, and the pillar bump in the cover layer protrudes from the lateral surface of the cover layer via the lateral opening.