The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2014
Filed:
Jan. 17, 2013
Chipbond Technology Corporation, Hsinchu, TW;
Chipbond Technology Corporation, Hsinchu, TW;
Abstract
A semiconductor manufacturing process includes the following steps of providing a silicon substrate having at least one connection pad and a protection layer, forming a first seed layer having at least one first section and at least one second section, forming a first photoresist layer, forming a first buffer layer having a coupling portion and a cladding portion, removing the first photoresist layer, removing the second section of the first seed layer to form a first under bump metallurgy layer, forming a support layer on the protection layer and the first buffer layer, the first under bump metallurgy layer has a first ring wall, the first buffer layer has a second ring wall, wherein the first ring wall, the second ring wall and the cladding portion are cladded by the support layer, and forming a connection portion and covering the coupling portion with the connection portion.