This inventor holds 1 USPTO granted patent. Top assignee: Chipbond Technology Corporation. Active years: 2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014
Title: Innovations of Kai-Yi Wang in Semiconductor Manufacturing
Introduction
Kai-Yi Wang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor manufacturing. His innovative work has led to the development of a unique semiconductor manufacturing process.
Latest Patents
Kai-Yi Wang holds a patent for a semiconductor manufacturing process and structure. This process includes several steps, such as providing a silicon substrate with at least one connection pad and a protection layer. It also involves forming a first seed layer, a first photoresist layer, and a first buffer layer. The process further includes removing the first photoresist layer and forming a support layer on the protection layer and the first buffer layer. His patent is a testament to his expertise in the semiconductor industry, with 1 patent to his name.
Career Highlights
Kai-Yi Wang is currently employed at Chipbond Technology Corporation. His role at the company allows him to apply his innovative ideas in a practical setting. His work has contributed to advancements in semiconductor technology.
Collaborations
Some of his coworkers include Cheng-Hung Shih and Yung-Wei Hsieh. Their collaboration in the field of semiconductor manufacturing has fostered an environment of innovation and creativity.
Conclusion
Kai-Yi Wang's contributions to semiconductor manufacturing highlight his role as an inventor in the technology sector. His innovative processes continue to influence the industry and pave the way for future advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile