Company Filing History:
Years Active: 2014
Title: Innovations of Kai-Yi Wang in Semiconductor Manufacturing
Introduction
Kai-Yi Wang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor manufacturing. His innovative work has led to the development of a unique semiconductor manufacturing process.
Latest Patents
Kai-Yi Wang holds a patent for a semiconductor manufacturing process and structure. This process includes several steps, such as providing a silicon substrate with at least one connection pad and a protection layer. It also involves forming a first seed layer, a first photoresist layer, and a first buffer layer. The process further includes removing the first photoresist layer and forming a support layer on the protection layer and the first buffer layer. His patent is a testament to his expertise in the semiconductor industry, with 1 patent to his name.
Career Highlights
Kai-Yi Wang is currently employed at Chipbond Technology Corporation. His role at the company allows him to apply his innovative ideas in a practical setting. His work has contributed to advancements in semiconductor technology.
Collaborations
Some of his coworkers include Cheng-Hung Shih and Yung-Wei Hsieh. Their collaboration in the field of semiconductor manufacturing has fostered an environment of innovation and creativity.
Conclusion
Kai-Yi Wang's contributions to semiconductor manufacturing highlight his role as an inventor in the technology sector. His innovative processes continue to influence the industry and pave the way for future advancements.