The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2013
Filed:
Feb. 10, 2011
Chih-ming Kuo, Xinfeng Township, Hsinchu County, TW;
Yie-chuan Chiu, Hsinchu, TW;
Cheng-hung Shih, Lugang Township, Changhua County, TW;
Lung-hua Ho, Hsinchu, TW;
Chih-Ming Kuo, Xinfeng Township, Hsinchu County, TW;
Yie-Chuan Chiu, Hsinchu, TW;
Cheng-Hung Shih, Lugang Township, Changhua County, TW;
Lung-Hua Ho, Hsinchu, TW;
Chipbond Technology Corporation, Hsinchu, TW;
Abstract
A process for forming an anti-oxidant metal layer on an electronic device comprises the steps of providing a substrate; forming a conductive metal layer on the substrate; forming a first photoresist layer on the conductive metal layer; patterning the first photoresist layer to form apertures and first grooves; forming a connecting member having a top surface and a lateral surface in the aperture and the first groove; removing the first photoresist layer to reveal the top surface and the lateral surface; forming a second photoresist layer on the conductive metal layer; patterning the second photoresist layer to form apertures and second grooves; forming an anti-oxidant metal layer in aperture and second groove, the anti-oxidant metal layer covers the top surface and the lateral surface of the connecting member; and removing the second photoresist layer to reveal the anti-oxidant metal layer and the conductive metal layer.