Company Filing History:
Years Active: 2014
Title: Chih-Hung Wu: Innovator in Pyramid Bump Structure Technology
Introduction
Chih-Hung Wu is a notable inventor based in Zhubei, Taiwan. He has made significant contributions to the field of electrical engineering, particularly in the development of innovative structures for enhancing electronic connections.
Latest Patents
Chih-Hung Wu holds a patent for a unique invention titled "Pyramid bump structure." This invention involves a pyramid bump structure designed for electrically coupling to a bond pad on a carrier. The structure includes a conductive block positioned at the bond pad and an oblique pyramid insulation layer that covers one side of the conductive block. The oblique pyramid insulation layer features a tapered design, with its outer diameter decreasing from the bottom portion to the top portion. This design allows the pyramid bump structure to quickly embed into an anisotropic conductive film when the carrier is connected to a substrate, thereby increasing the flow rate of the film. Additionally, this innovation helps prevent short circuits between adjacent bumps, ultimately improving the yield rate of the packaging process.
Career Highlights
Chih-Hung Wu is currently employed at Chipbond Technology Corporation, where he continues to work on advancements in electronic packaging technologies. His expertise in this area has positioned him as a valuable asset to his company and the industry at large.
Collaborations
Throughout his career, Chih-Hung Wu has collaborated with esteemed colleagues, including Lung-Hua Ho and Chih-Ming Kuo. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Chih-Hung Wu's contributions to the field of electrical engineering, particularly through his patent for the pyramid bump structure, demonstrate his commitment to advancing technology. His work not only enhances the efficiency of electronic connections but also contributes to the overall improvement of packaging processes in the industry.