The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Sep. 29, 2023
Chipbond Technology Corporation, Hsinchu, TW;
Chin-Tang Hsieh, Kaohsiung City, TW;
Lung-Hua Ho, Hsinchu City, TW;
Chih-Ming Kuo, Hsinchu County, TW;
Chen-Yu Wang, Hsinchu City, TW;
Chih-Hao Chiang, Hsinchu County, TW;
Pai-Sheng Cheng, Hsinchu City, TW;
Kung-An Lin, Hsinchu City, TW;
Chun-Ting Kuo, Kaohsiung City, TW;
Yu-Hui Hu, Pingtung County, TW;
Wen-Cheng Hsu, Hsinchu County, TW;
CHIPBOND TECHNOLOGY CORPORATION, Hsinchu, TW;
Abstract
A semiconductor package includes a substrate, first bumps, a first chip, metal pillars, second bumps and a second chip. The substrate includes first and second conductive pads which are located on a top surface of the substrate. Both ends of the first bumps are connected to the first conductive pads and the first chip, respectively. Both ends of the metal pillars are connected to the second conductive pads and one end of the second bumps, respectively. A cross-sectional area of each of the metal pillars is larger than that of each of the second bumps. The second chip is connected to the other end of the second bumps and located above the first chip.