Pai-Sheng Cheng

Title: Pai-Sheng Cheng: Innovator in Flip-Chip Bonding Technology

Introduction

Pai-Sheng Cheng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronic packaging, particularly through his innovative patents. With a total of 3 patents, Cheng continues to push the boundaries of technology in his industry.

Latest Patents

Cheng's latest patents include a "Flip-chip bonding structure and substrate thereof" and an "Electronic package and method of manufacturing the same." The flip-chip bonding structure patent describes a design that includes a substrate and a chip, featuring a lead with a body, a hollow opening, a bonding island, and connecting bridges. This innovative design ensures that solder is restricted to the bonding island, preventing overflow and chip shifting. The electronic package patent outlines a method for manufacturing an electronic package, which involves forming grooves on a circuit structure to create circuit layers. This method allows for a shielding layer to be applied without leaving burrs on the final product.

Career Highlights

Cheng is currently employed at Chipbond Technology Corporation, where he applies his expertise in electronic packaging. His work has been instrumental in advancing the technology used in modern electronic devices.

Collaborations

Cheng collaborates with talented individuals in his field, including Chen-Yu Wang and Lung-Hua Ho. Their combined efforts contribute to the innovative projects at Chipbond Technology Corporation.

Conclusion

Pai-Sheng Cheng is a prominent inventor whose work in flip-chip bonding technology has made a significant impact on the electronics industry. His patents reflect a commitment to innovation and excellence in electronic packaging.